EKV/Supplier DOE for Solder Ball Elimination
VISION: Satisfy EKV’s customer, Boeing, that we have control of our suppliers and that in-coming hardware is tops in quality and reliability.
OBJECTIVE: Team with SMART Electronics to understand and reduce/eliminate solder ball generation in circuit card surface-mount assembly process.
IMPROVEMENTS INCLUDE: The DOE shows 80.6% reduction of solder balls using a new solder paste. Pinpointed adding of PWB fiducials as major reducer of solder ball formation as solder paste registration will be computer controlled.
RESULTS INCLUDE:
Boeing pleased that we are addressing supplier issues.
Rework cycle time reduced 30%.
Rework cost avoidance of $155/cca.
Process improvements including new solder paste, thinner stencils and request for fiducials on PWBs for use of automated screen printer.