SEA’s Printed Circuit Board Assembly and Test capabilities can improve your competitive advantage with faster time to market, improved product quality and increased profitability.

We offer the latest technology and processes combined with state-of-the-art quality management systems to provide world class Printed Circuit Board (PCB) Assembly and Testing.

SEA specializes in medium volume, high mix/high complexity printed circuit board assembly utilizing surface mount technology (SMT) placement including ball grid array (BGA) as well as plated through hole (PTH) printed circuit board assemblies. All of our facilities feature state-of-the-art equipment, tight process monitoring, in-circuit test (ICT), and x-ray inspection capabilities.

Our portfolio of cost-effective printed circuit board assembly services is designed to meet our customers’ needs for a wide range of requirements for volume, mix, and complexity. We leverage strategic partnerships with leading suppliers of state-of-the-art assembly and test equipment, collaborating on process development and performing regular process evaluations. These partnerships further enable us to deliver the most cost-effective technology solutions to our customers.