There are four separate major phases to our Surface Mount Technology process: screen printing, component placement, solder re-flow, and automated optical inspection (AOI). All systems in place provide precision optical and laser placement, flexibility, high through put rate, and other unique features.

With dedicated engineering personnel on every prototype run we provide feedback to our Custer regarding DFM (design for manufacturing), improving manufacturability and reducing production costs.

• For quick-turn, low volume, fast set-up we utilize offline Contact & Amistar pick and place machines
• For high end/rel production state-of-the-art Fuji inline systems that can handle BGA & Micro BGA and with the addition of our new Fuji CP643 we can able to place package sizes down to .0201
• Pick & Place programming is done using customer provided design CAD data for faster & accurate assembly
• Fuji Flexa is utilized for our Pick & Place program optimizerGA, Micro BGA, CSP (chip scale packaging), QFP (Quad Flat Pack), and any other packaging type.
• Utilize state-of-the-art BTU INT. 7 Zone Forced Air Convection Re-flow Ovens.
• Handle any board size up to 20”x20” and up to 36layers.
• BGA, Micro BGA, CSP (chip scale packaging), QFP (Quad Flat Pack), and any other packaging type.
• 50k+ CPH (Components per hour) capability.
• High Mix Low Volume
• Double sided capability
• Auto & Semi Auto paste deposition
• Rigid, Flex, & Rigid/flex
• Custom fixtures