SEA utilizes state-of-the-art X-ray inspection equipment using NIS (Nicolet Imaging Systems) NXR-1410HR x-ray inspection machine and NIS VCP-40 Image Processor.
X-ray inspection is the only method of inspecting BGA’s &Micro BGA’s after re-flow. With our modern equipment we can inspect for proper solder ability, proper placement and inspect for shorts. Our system can also archive and print all images for records and verification.
X-Ray Inspection Quality Assurance Testing and Process Monitoring (bold and space)
SEA utilizes state-of-the-art X-ray inspection equipment using NIS (Nicolet Imaging Systems) NXR-1410HR x-ray inspection machine and NIS VCP-40 Image Processor.
X-ray inspection systems display gray-scale images, which represent variances in the shape and thickness of an object. High-density features produce a darker image than those do with lesser density or thickness. Therefore, it is possible to quantitatively measure these features and develop correlation between acceptable or unacceptable manufacturing process conditions.
During an inspection, X-rays emitted from the source pass through the circuit board to an Image Intensifier. The images are then directed from the detector through a mirrored assembly to a video camera, where the digitized images are sent to an image processor for display, enhancement, and analysis. X-ray inspection can reveal a number of defects, whether hidden or visible, including open or shorted solder joints, lifted leads, component misregistration, chip tombstoning, voiding, and unacceptable size variations in solder bumps (as in BGA components).
2000 W Corporate Way, Anaheim CA 92801 Tel: 714-991-6500 Fax: 714-991-6200 info@smartelec.com
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